Procurement of Pre-Assembled and Pre-Laminated Polycarbonate Sheets Embedded with Chip and Antenna for ID1 Cards

The Pakistan Security Printing Corporation (Pvt.) Ltd (PSPC) invites sealed bids through the e-Pak Acquisition and Disposal System (EPADS) v2.0 for the procurement of pre-assembled and pre-laminated polycarbonate sheets embedded with chip and antenna for ID1 type cards. This procurement is planned for the financial year 2026-27 and aims to acquire high-quality RFID inlay sheets suitable for secure identity card manufacturing in Karachi, Sindh. Items being procured: - Pre-assembled and pre-laminated polycarbonate sheets embedded with semiconductor chip and antenna (RFID) for ID1 cards - Quantity: 5,500 sheets total, with 42 cards per sheet (6 x 7 matrix) - Delivery schedule: 2,500 sheets within 60 days, 3,000 sheets within 100 days The technical scope includes manufacturing of polycarbonate inlay sheets with embedded MIFARE DESFire EV3 8K chips operating at 13.56 MHz, compliant with ISO/IEC 7810 and ISO/IEC 14443 Type A standards. The sheets must be 100% polycarbonate with a thickness of approximately 325 microns after lamination. The antenna must be insulated pure copper wire, and the chip must withstand operating temperatures from -25°C to +85°C, support at least 10 years data retention, and endure 50,000 write/erase cycles. The supplier must provide a whitelist of RFID chips for traceability and ensure full technical support during testing and evaluation. Eligibility criteria require the bidder to be the primary manufacturer/OEM with in-house capabilities for antenna formation, chip embedding, assembly, and pre-lamination. No subcontracting of critical manufacturing processes is allowed. The bidder must have supplied over 100 million semiconductor chips for secure identity documents in the past 10 years, hold ISO 9001 and ISO/IEC 27001 certifications or equivalents, maintain a business continuity plan, and demonstrate an average annual turnover of at least USD 50 million over the last five fiscal years. Bids must be submitted electronically via EPADS v2.0 by Thursday, November 19, 2026, at 11:00 AM PKT. Original bid security must be submitted physically at PSPC's office in Malir Halt, Jinnah Avenue, Karachi before the deadline. Technical bids will be evaluated based on compliance and sample qualification, followed by financial evaluation using Least Cost Based Selection (LCBS). Manual bid submissions will not be entertained. A practical tip for bidders: Ensure timely registration and familiarization with the EPADS v2.0 portal to avoid disqualification due to late or incorrect bid submission. Also, submit fully functional sample inlay sheets embedded with the specified chip and antenna as these will be tested for compatibility and approval by the end user. Contact Person: Deputy General Manager Procurement Phone: +92-219-924-8511 Email: foreign.purchase@pspc.gov.pk Website: https://epads.gov.pk/opportunities/federal/procurements/171768 Submission Method: Electronic submission via EPADS v2.0 portal; original bid security to be submitted physically at PSPC Karachi office. This procurement offers a significant opportunity for qualified manufacturers to supply advanced RFID inlay sheets for secure identity card production under stringent technical and quality standards.