Supply and Installation of Machinery & Equipment for PGA Technology Labs

The Technical Education & Vocational Training Authority (TEVTA) Lahore invites encrypted electronic bids under Single Stage Two Envelopes National Competitive Bidding Procedure from active tax bidders registered on Punjab E-Procurement (eP) System and also registered with Income Tax and Sales Tax Department for supply and installation (where applicable) of machinery and equipment packages for PGA Technology labs at specified locations. Items being procured: - Machinery & Equipment Of C&D Plate, Flexography & Photogravure Lab Of PGA Technology (Estimated Cost Rs. 28,000,000) - Machinery & Equipment of Mechanical and Offset Labs PGA Technology (Estimated Cost Rs. 3,100,000) - Machinery & Equipment of Book Binding of PGA Technology (Estimated Cost Rs. 40,270,000) The procurement involves supply and installation of specialized machinery and equipment for printing and binding technology labs. Bidders must be registered with relevant tax authorities and comply with the Punjab E-Procurement system requirements. Bid security amounts vary per package and must be submitted online in the form of PSID; personal cheques are not acceptable. Bids must be submitted online via the Punjab E-Procurement portal by 10:30 A.M on 3rd November 2026. Technical and financial bids will be opened electronically as per schedule. Detailed terms, conditions, and bidding documents are available free of cost on the Punjab E-Procurement system and PPRA website. Bidders are advised to upload their bids well before the deadline to avoid last-minute issues. TEVTA will not be responsible for any technical problems during submission. In case of a holiday, the tender will be opened on the next working day. Visit https://eproc.punjab.gov.pk/ActiveTenders.aspx for more information. A practical tip for bidders: Ensure your PSID bid security is generated and submitted online as per instructions to avoid disqualification. Also, carefully review the bidding documents for compliance with technical specifications and submission requirements.