Procurement of DOVIDs (Holograms) for Polycarbonate Based Smart ID3 Cards

This tender invites bids for the supply of DOVIDs (Diffractive Optically Variable Image Devices) or holograms for Polycarbonate (PC) based Smart ID3 Cards in Karachi by the Pakistan Security Printing Corporation (PSPC). The procurement falls under the Security & Safety Equipment category and is scheduled for the financial year 2025-26. The scope includes manufacturing and delivery of seven million holograms compatible with Muhlbauer's SSH 2008/2 stamping machines. The DOVIDs must be circular, 18mm in diameter, and incorporate advanced security features such as zero and first order DOVID technologies for overt, covert, and forensic control levels. The holograms must be visible to the naked eye and bonded within polycarbonate layers to prevent delamination. The successful bidder will also be responsible for design modifications if required, and must submit 1,000 sample holograms with required security features for evaluation. Delivery is expected within 90 days of purchase order issuance, with staged shipments by air or sea. Bidders must be original manufacturers or authorized agents with certifications including ISO 9001, ISO 14001, ISO 14298, and membership in the International Hologram Manufacturer Association (IHMA) for at least five years. They must demonstrate a minimum annual turnover of 10 million euros over the last three years and provide at least five references of government projects involving DOVIDs or holograms. Compliance with FBR Active Taxpayer List and other regulatory requirements is mandatory. Submission deadline is **May 7, 2026 at 11:00 AM**, with bid opening at 11:30 AM at PSPC Karachi office. Bids must be submitted electronically via EPADS portal. The physical address for correspondence is Pakistan Security Printing Corporation, Jinnah Avenue, Malir Halt, Karachi. Bid security of PKR 3,500,000 is required in specified forms. The contract includes a 12-month warranty period with free replacement of defective holograms. Payment will be made through irrevocable letter of credit. Pro-Tip: Ensure timely submission of original bid security to avoid immediate rejection. Also, attend the pre-bid meeting on April 15, 2026, to receive detailed design information under NDA and clarify technical requirements. Carefully review the mandatory sample submission criteria as failure to provide samples will lead to disqualification.